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Failure Category	-Select a failure category- Assembly/Soldering Components Field Failure Printed Circuit Board
Description:
Probable cause:
Solder alloy:	- Select a solder alloy - Tin Lead Lead Free Unknown
Soldering Process	- Select a soldering process - Convection Reflow Hand Soldering Selective soldering Vapour Phase Soldering Wave Soldering General Assembly
Failure location	- Select Failure Location - Field Process Unknown
Number of failures found:
Volume of this product:	- Select Product Volume - Low (<10 per week) Medium (10 to 50 per week) High (>50 per week) Unknown
Product Application	- Select Product Application - Automotives Consumer/Commercial Medical Military/Aerospace Telecommunications Others
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(*) These will be kept confidential and will not be included in the database.